Capability
Our R&D and NPI Centre in Hong Kong keep Gentech to stay competitive in the industry. With the capability of the manufacturing plant in China, Gentech has the competitive advantage of “Advance Technology, Reliable Quality, High Productivity’.
Standardized Quality | Customized Service | Assembling Innovation
R&D and NPI Centre
Shatin, Hong Kong
Assembly Plant
Dongguan, China
PCB Scope
Rigid, Flexible, Flex-Rigid, HDI,
Aluminum, and Semi-Flex PCBs
Maximum PCB Size
Standard: 330mm x 250mm
Advanced: 410mm x 360mm
Component Size
From 1005 to 24mm x 72mm
Wire Bonding
Fine Pitch 55um x 65um
High Speed Wire Bonding
6.5 wires/second
BGA, Micro-BGA, FGBA
Flip Chip and CSP
Minimum Ball Pitch 0.2mm
Ball Dimension 0.1mm
Depanelization
Routing Machine
Scoring Machine
Fine Pitch IC
Minimum 0.2mm pitch
IC Programming
(Online/Offline)
Manufacturing
Specification
IPC 610 Class 2&3
Surface Mount Capacity:
78 Million chips/month
Lead Free Soldering
Surface Mount Reflow, Wave Soldering
Selective Soldering, Robotic Soldering
Testing Capability
AOI, ICT, X-Ray, SPI, Burn-In Test
Customized Functional Test
7 Surface Mount
Technology Lines
Box Assembly
Cable
Harness
Assembly
Conformal Coating
and Nano Coating
BGA
Rework
Station
Turnkey Solution
We will learn your needs and solve obstacles together. We aim to serve you better through our value-filled manufacturing experiences.
